Of course, I could give more examples of copper thickness within PCBs.
For example, in multilayer boards, the inner copper layer is usually thinner. Common thicknesses are 1/2oz (1/2 weight of 1 ounce of copper foil, approximately 17.8 microns), 1/3oz (1/2 of 1 ounce of copper foil). /3 weight, approximately 12.4 microns), etc. The outer copper layer is usually thicker, and common thicknesses are 1oz (35 microns), 2oz (70 microns), etc.
In addition, for some PCBs that require excessive current, some parts will use thicker inner copper thickness, such as 70 microns or 105 microns. These thicker inner copper layers can carry greater current, increasing the circuit board's power-carrying capacity.
In addition, in some special cases, in order to meet specific signal transmission requirements, the inner copper thickness will also change. For example, for circuit boards that require high-speed signal transmission, the inner copper layer may be thicker to reduce the impedance of the circuit board and improve the stability and reliability of signal transmission.
In short, the inner copper thickness of the PCB is comprehensively considered based on the design requirements and cost factors of the circuit board. When designing a circuit board, the appropriate inner copper thickness needs to be selected based on specific application requirements and design needs.