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What material is the circuit board substrate made of a circuit?

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The circuit board substrate is made of high-purity alumina (alumina) as the main raw material, which is formed by high-pressure molding, fired at high temperature, and then cut and polished.
Substrate materials are the basic materials for manufacturing semiconductor components and printed circuit boards, such as silicon, gallium arsenide, silicon epitaxial needle garnet, etc. used in the semiconductor industry.

Substrate material is the basic material for manufacturing semiconductor components and printed circuit boards, such as silicon, gallium arsenide, silicon epitaxial needle garnet, etc. used in the semiconductor industry. Made from high-purity alumina (alumina) as the main raw material, it is formed by high-pressure molding, fired at high temperature, and then cut and polished. Ceramic substrates are the basic material for manufacturing thick-film and thin-film circuits. Copper-clad laminate (referred to as foil-clad laminate) is a substrate material for manufacturing printed circuit boards. In addition to supporting various components, it can also achieve electrical connection or electrical insulation between them.

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Commonly used substrate materials for printed circuit boards include paper-based CCL, epoxy glass cloth-based CCL, composite-based CCL, metal-based CCL, flexible CCL, ceramic substrates, and copper-clad polyimide fiberglass cloth for high-frequency circuits. Laminate, BT resin.
The main material of the circuit board is a non-conductive basic material, usually a cellulose base material laminated with insulating fiberglass cloth. This substrate is called FR-4, which stands for Flame Retardant 4.
FR-4 material has good insulation, mechanical strength and stability, and can meet the needs of most electronic products.

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Commonly used raw materials in the PCB processing industry mainly include fiberglass yarn, copper foil, copper clad laminate, epoxy resin, ink, wood pulp, etc. Among them, copper-clad laminate is made of copper foil, epoxy resin, glass fiber yarn and other raw materials.

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In addition to the base material, the circuit board needs to be covered with a metallic conductive layer, usually using copper or aluminum. The metal conductive layer can be formed by chemical deposition, electroplating and other methods to form a conductive path on the circuit board. During the circuit board manufacturing process, the conductive layer is usually divided into many different areas, each area corresponding to a different circuit component.

When making a circuit board, the base material is first cut into the required size and a metal conductive layer is coated on it. Then, Photolithography, electroplating and other processes are performed on the conductive layer to form components such as wires and pads, and chemical methods are used to remove excess metal. Finally, the required electronic components are fixed on the circuit board through welding and other methods to complete the construction of the entire circuit.

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Circuit boards perform many other functions besides connecting and supporting electronic components. For example, multi-layer circuit boards can transmit signals between different layers through the inner conductive layer, improving the integration and stability of the circuit. In addition, information such as components and circuits can be added to the circuit board to facilitate identification and operation during electronic production and maintenance.

To summarize, a circuit board is made up of a base material made of insulating fiberglass cloth laminated with a covering metal conductive layer. It is an important component that connects and supports electronic components, allowing them to function properly.

The material selection and manufacturing process of circuit boards are crucial to the performance and stability of electronic products. The editor of Xinfenghuihe hopes that this article can help readers better understand the definition and production process of circuit boards.

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The substrate is an important part of the integrated circuit board and plays the role of carrying other components. There are many kinds of substrate materials currently used, among which common ones include glass fiber cloth substrate, electronic grade printed board (PCB), etc. Glass fiber cloth substrate is currently the most commonly used material for making integrated circuit boards. It has the advantages of high strength and good thermal conductivity, and can also reduce temperature changes of electronic components. 

PCB production technology has developed to a very mature level and can produce high-quality electronic devices.

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