The circuit board substrate is made of high-purity alumina (alumina) as the main raw material, which is formed by high-pressure molding, fired at high temperature, and then cut and polished.
Substrate materials are the basic materials for manufacturing semiconductor components and printed circuit boards, such as silicon, gallium arsenide, silicon epitaxial needle garnet, etc. used in the semiconductor industry.
Substrate material is the basic material for manufacturing semiconductor components and printed circuit boards, such as silicon, gallium arsenide, silicon epitaxial needle garnet, etc. used in the semiconductor industry. Made from high-purity alumina (alumina) as the main raw material, it is formed by high-pressure molding, fired at high temperature, and then cut and polished. Ceramic substrates are the basic material for manufacturing thick-film and thin-film circuits. Copper-clad laminate (referred to as foil-clad laminate) is a substrate material for manufacturing printed circuit boards. In addition to supporting various components, it can also achieve electrical connection or electrical insulation between them.