Question

What are the consequences of improper copper immersion process mac

Answer 1

Improper copper immersion process may bring the following consequences:

1. No copper in the hole: If there is a problem with the copper immersion process, such as improper selection of potion, inappropriate concentration, inappropriate temperature, etc., the copper layer will not be deposited normally and there will be no copper in the hole.

2. Insufficient bonding force: If excessive corrosion or insufficient micro-etching occurs during the copper immersion process, blistering will occur around the orifice and affect the bonding force between the copper layer and the substrate.

3. Line damage: If excessive corrosion occurs during the copper immersion process, it will corrode the copper foil of the line. In severe cases, it may lead to disconnection and make the board fail.

4. Rough surface: If excessive micro-etching occurs during copper immersion, the surface will be rough and uneven, affecting the appearance quality.

5. Environmental issues: The chemicals used in the copper immersion process may cause pollution to the environment and require corresponding treatment and emission control.

6. Metal ion pollution: Copper ion deposition produced by corrosion will affect the conductivity of parts, leading to reduced performance or failure of electronic equipment.

Therefore, improper copper immersion process will have adverse effects on the manufacturing and quality of PCB boards. Corresponding measures need to be taken to improve and optimize to ensure the smooth progress and stable quality of the copper immersion process. At the same time, attention should also be paid to operating specifications and quality control during the production process to avoid process problems.

Answer 2

Improper PCB manufacturing plate making process may lead to the following consequences:

1. No copper in the holes: If there are problems with the manufacturing plate making process, such as insufficient exposure, improper development, etc., there will be no copper in the holes.

2. Circuit damage: If there are problems with the manufacturing and platemaking process, such as overexposure, overdevelopment, etc., circuit damage will occur.

3. Board surface contamination: If there are problems with the manufacturing and plate making process, such as improper surface treatment, adhesion of pollutants, etc., it will lead to board surface contamination.

4. Uneven plate thickness: If there are problems with the manufacturing plate making process, such as improper material selection, poor lamination process, etc., uneven plate thickness will result.

5. Warpage deformation: If there are problems in the manufacturing and plate making process, such as improper material selection, poor heat treatment process, etc., warpage deformation will occur.

Therefore, improper PCB manufacturing plate making process will have adverse effects on the manufacturing and quality of PCB boards. Corresponding measures need to be taken to improve and optimize to ensure the smooth progress and stable quality of the manufacturing plate making process. At the same time, attention should also be paid to operating specifications and quality control during the production process to avoid process problems.