Printed circuit board (PCB) substrates can use many types of polymers. These polymers include:
1. Polyimide (PI): This is a common polymer material used in manufacturing flexible circuit boards. It has excellent high temperature resistance and chemical properties and is suitable for applications requiring high temperature and/or chemical compatibility.
2. Polyimide-amine (PAI): This is a high-temperature resistant nylon material commonly used in the manufacture of thermal insulation materials for printed circuit boards.
3. Polyetheretherketone (PEEK): This material has excellent mechanical properties, high temperature resistance and chemical properties, and is widely used in the manufacture of components such as circuit board sockets, connectors and terminals.
4. Polyetherimide (PEI): This material has high strength, high rigidity and good electrical insulation properties, and is suitable for manufacturing circuit board substrates and other electronic components.
5. Polytetrafluoroethylene (PTFE): This material has excellent high temperature resistance and chemical properties and is often used to make thermal insulation materials for circuit boards.
In addition to the above-mentioned polymer materials, materials such as epoxy resin, polyester, polycarbonate, etc. can also be used to manufacture the substrate of the printed circuit board. The choice of material depends on the specific requirements of the application, including high temperature and chemical resistance, mechanical strength, electrical insulation properties, etc.