Question

What is PCB manufacturing process?

Answer 1

The PCB manufacturing process flow is as follows:

1. CutLamination/Material cutting. According to the sheet materials required by the engineering design, cutting, angle grinding, edge planing and other processing are performed to generate the required substrate size.

2. Inner layer circuit production. A photosensitive dry film is applied to the copper plate, and then the circuit pattern is produced through exposure and development.

3. Drilling. Drill holes on the substrate according to the design requirements to install electronic components.

4. Impedance processing. During the drilling process, impedance treatment must be performed to ensure normal transmission of the circuit.

5. Pressing. The PP sheets are pressed together through high temperature and high pressure to ensure the bonding strength of the inner core board.

6. Brown oxidation. Chemical principles are used to generate an oxide layer on the clean copper surface to ensure the quality of subsequent etching processes.

7. Etching. Use a chemical etching solution to treat the oxide layer to remove the oxide layer and expose the copper surface.

8. Lamination. Use lamination glue to press the PCB board and circuit board together to ensure the connection strength of the circuit.

9. Drilling. Drill holes on the circuit board according to the design requirements to connect external circuits.

10. PCB surface treatment. Clean, dry, and coat the surface of the circuit board to improve the performance and reliability of the circuit board.

11. Inspection. Inspect circuit boards to ensure they meet design requirements and make necessary corrections.

Answer 2

The PCB manufacturing process includes the following steps:
1. CutLamination/Material cutting: Cut the substrate into the required size according to the requirements.
2. Pretreatment: remove contaminants on the copper surface and increase the roughness of the copper surface to facilitate the subsequent lamination process.
3. Dry Film Lamination: Apply a resist dry film to the treated copper surface of the substrate through hot pressing.
4. Exposure: The image on the original film is transferred to the photosensitive plate through the action of light.
5. Developing: Use alkali solution to wash away the dry film part that has not undergone chemical reaction.
6. Etching: Use chemical solution to etch away the exposed copper after development to form the inner circuit pattern.
7. Stripping: Use strong alkali to peel off the resist layer protecting the copper surface to expose the circuit pattern.
8. Punching: Use CCD alignment to punch out positioning holes and rivet holes for inspection operations.