Thermoelectrically Separated Copper Substrate (TESC) is a special type of metal substrate mainly used in electronic packaging and thermal conduction applications. It consists of conductive layer, insulating layer and copper layer.
The thermoelectric separation copper substrate is characterized by excellent thermal conductivity. The copper layer in its structure is separated by an insulating layer, which effectively reduces the thermal conduction path and improves the thermal conductivity of the substrate. However, common metal substrates, such as aluminum substrates or copper-aluminum composite substrates, have poor thermal conductivity due to the lack of separation between the thermal conductive layer and the electrical layer.
The preparation process of thermoelectric separation copper substrate generally includes the following steps:
Coat the copper foil with an insulating layer material such as epoxy.
The insulation layer material and the copper foil are tightly bonded through processes such as hot pressing or high-temperature curing.
A secondary conductive layer, usually copper foil or copper powder paste, is applied to the insulating layer.
Hot pressing or heat curing is performed again to bond the secondary conductive layer and the insulating layer.
Follow-up processing is performed as required, such as drilling, gold plating, etc.
Thermoelectric separation copper substrates are widely used in high-power LED packaging, power modules, high-frequency circuits and other fields due to their excellent thermal conductivity. It can effectively improve the heat dissipation effect of electronic devices, maintain the stable operating temperature of components, and improve the reliability and performance of products.