Mobile phone PCB assembly materials require the following types:
1. Substrate: copper-clad substrate, resin board with copper on both sides. The most commonly used plate code is FR-4, which is mainly used in electronic products such as computers and communication equipment. The requirements for the board include flame resistance, Tg point, dielectric constant, etc.
2. Copper foil: A conductor that forms wires on a substrate. There are two methods in the process of copper foil: rolling and electrolysis.
3. PP: An indispensable raw material in circuit board production, its function is the adhesive between layers.
4. Dry film: Photosensitive dry film is referred to as dry film. The main component is a resinous substance that is sensitive to a specific spectrum and undergoes photochemical reactions.
5. Solder resist: It is actually a solder resist, a liquid photosensitive material that has no affinity for liquid solder. Like photosensitive dry film, it will change and harden under the irradiation of light of a specific spectrum. When used, the solder mask must be mixed with a hardener.
In addition, mobile phone PCB assembly materials also include film PCB materials, etc. The selection and use of these materials directly affects the quality and performance of the mobile phone, so careful selection and strict quality control are required in actual production.