PCB hard gold plating is a process of electroplating a layer of hard gold (Gold) on the surface of PCB.
Its main components are pure gold and other alloy elements. This process has extremely strong conductivity and excellent corrosion resistance, can prevent oxidation and corrosion on the PCB surface, provide good welding performance, and is suitable for high-temperature welding processes.
Hard gold plating is often used in high-end electronic products, such as communication equipment, military equipment, etc.
Regarding the specifications of PCB hard gold plating, the specific parameters may vary depending on different applications and needs. Here are some common specifications:
1. Gold plating layer thickness: The thickness of the gold plating layer is a key specification parameter, usually in microns (um). Different applications may require different gold plating thicknesses. For example, for areas that require high wear resistance, such as gold fingers and keyboards, a thicker gold plating layer may be required.
2. Gold plating layer composition: The gold plating layer composition is also an important specification parameter. Usually, the gold plating layer is composed of pure gold and other alloying elements. Different alloying elements and proportions may affect the properties of the gold plating layer, such as electrical conductivity, corrosion resistance and welding performance.
3. Gold plating process: Gold plating process is also one of the specifications parameters that need to be considered. Common gold plating processes include electroplating and chemical plating.
Electroplating is the deposition of metal on the surface of PCB through electrolysis, while electroless plating forms a metal layer on the surface of PCB through chemical reaction. Different processes may affect the uniformity, adhesion and performance of the gold plating layer.
It should be noted that the specific PCB hard gold plating specifications should be determined based on specific applications and needs.
When selecting gold plating processes and parameters, it is recommended to consult and discuss with the PCB manufacturer or gold plating service provider to ensure that the selected gold plating specifications can meet the requirements and performance of the product.