In addition to chemical materials such as copper foil, adhesives, hardeners, solder mask inks, and printing inks.
The following chemical materials are also used in the PCB manufacturing process:
1. Acidic etchant: used to etch the copper foil on the circuit board to form circuit patterns.
2. Alkaline etchant: also used to etch copper foil on circuit boards.
3. Acidic copper plating solution: used to deposit copper on circuit boards to form circuit patterns.
4. Alkaline copper plating solution: also used to deposit copper on circuit boards.
5. Acidic nickel plating solution: used to deposit nickel on circuit boards to improve the corrosion resistance and conductivity of the circuit.
6. Alkaline nickel plating solution: also used to deposit nickel on circuit boards.
7. Acidic gold plating solution: used to deposit gold on circuit boards to improve the conductivity and corrosion resistance of the circuit.
8. Alkaline gold plating solution: also used to deposit gold on circuit boards.
9. Remover: used to remove the resist on the circuit board to expose the copper foil.
10. Cleaning agent: used to clean residue and dirt on circuit boards.
These chemical materials play an important role in the PCB manufacturing process, ensuring manufacturing quality and efficiency. At the same time, attention needs to be paid to the reasonable selection and use of various chemical materials to avoid adverse effects on the environment and human body.