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Is PCB immersion gold a chemical method?

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The PCB immersion gold process is to immerse the circuit board in a chemical solution containing gold ions. Through an electrochemical reaction, the gold ions are reduced to metal and deposited on the surface of the circuit board to form a uniform metal film. During the deposition process, an extremely thin layer of oxide is formed on the metal film. This layer of oxide can effectively prevent metal corrosion, thus improving the corrosion resistance of the circuit board.

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PCB immersion gold uses chemical deposition method. Through chemical oxidation-reduction reaction, a layer of coating is generated, which is generally thicker. It is a kind of chemical nickel-gold gold layer deposition method, which can achieve a thicker gold layer.

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