The "line PAD" of a PCB refers to the metal area used for soldering connections to electronic component pins or other electrical components. It is a circular or square copper area formed on the surface of the PCB by methods such as electroplating or thermal transfer.
Line PAD provides a reliable connection point so that components can be electrically connected to wires, pads, etc. on the PCB. During the welding process, the line PAD plays the role of carrying the welding connection and transmitting electrical signals or current.
The pins or pads of electronic components are welded to the circuit PAD using solder (such as tin) to achieve a reliable electrical connection.
The size and shape of the line PAD varies depending on the size and spacing of the component pins and design requirements.
The design and layout of line PAD is very important to ensure the stability, reliability and performance of the circuit.
Therefore, during the PCB design process, the size, spacing, shape and distance between the line PAD and other components need to be carefully considered to meet the needs of electrical requirements and soldering processes.