The via manufacturing process in PCB mainly includes the following steps:
1. Drilling: Drill holes on the PCB substrate for subsequent connection work.
2. Cleaning: Use chemicals to clean the PCB substrate and remove contaminants in the holes.
3. Electroplating: Placing a layer of metal, usually copper, inside a hole to allow for electrical connections.
4. Solder mask: Cover the coating with a layer of solder mask to prevent the pad from being oxidized during subsequent circuit board processing.
5. Soldering pad: Make a soldering pad on the solder mask for later component soldering.
6. Testing: Test the PCB to ensure the manufacturing quality of the via and the reliability of the electrical connection.
The above are the basic steps of via manufacturing in PCB. The specific details may vary due to different manufacturing processes and requirements.