During the PCB production and manufacturing process, substances that may remain include solder slag, flux, oil, etc. If these substances are not completely removed, they will have a negative impact on the performance and quality of PCBA.
1. Solder slag: During the welding process, solder may form residues on the PCB surface, especially on the pads and pins. These solder slag may affect the welding quality and solderability, leading to subsequent poor welding or reduced electrical performance.
2. Soldering flux: During the welding process, the use of soldering flux can enhance the fluidity of the solder and improve the welding effect. However, solder may also remain on the PCB surface, which may affect solderability and reliability if not removed in time.
3. Oil contamination: PCB may come into contact with various greases, lubricants and other substances during the manufacturing process, and these substances may remain on the PCB surface. Oil contamination may cause PCB surface unevenness, reduce solderability and reliability, and also negatively impact the performance of electronic devices.
In order to ensure the performance and quality of PCBA, these residual substances need to be completely removed during the production process. This can be achieved by using appropriate cleaning agents and cleaning processes, such as using professional PCB cleaning agents for soaking, rinsing and drying to ensure a clean and tidy PCB surface.