During the PCB customization process, the following problems are prone to occur:
1. Pad overlap: Overlapping of pads (except for surface-mounted pads) will cause problems in the drilling process. For example, drilling multiple holes in one position may cause the drill bit to break, causing damage to the hole, or two holes in a multi-layer board. The holes overlap, causing the drilled holes to fail to meet the requirements.
2. Abuse of the graphics layer: During the design process, some useless connections are designed, so that the original four-layer board is designed with more than five layers of circuits, which can lead to misunderstandings and inconvenience. At the same time, violating conventional designs will also cause problems, such as designing the component surface on the Bottom layer and the welding surface on the Top layer.
3. Misplaced characters: Character cover pad SMD solder pads will cause problems in the on-off test of the printed board and the welding of components. At the same time, character design that is too small or too large will also cause difficulties in screen printing or problems with characters overlapping each other.
4. The problem of setting the aperture of a single-sided pad: When setting the aperture of a single-sided pad, it should generally be designed to be zero unless otherwise noted. If a value is set, the coordinates of the hole will appear when generating drilling data, which may cause problems.
5. The processing level is not clearly defined: If the single-board design is on the TOP layer, but there is no special instructions for front and back processing, then the manufactured board may be difficult to weld with components installed on it.
Specific issues may vary depending on actual production processes and specific requirements. It is recommended that during the PCB customization process, the operation should be strictly carried out in accordance with the production requirements and specifications, and timely communication and coordination with the manufacturer should be carried out to ensure quality and production efficiency.