In electronics, TSOP is the abbreviation of Thin Small Outline Package, which has the following characteristics:
1. Make pins around the packaged chip, suitable for installing wiring on PCB (Printed Circuit Board) using SMT technology (Surface Mount Technology).
2. In terms of external dimensions, the parasitic parameters (output voltage disturbance caused when the current changes significantly) are reduced, which is suitable for high-frequency applications. It is easier to operate and has higher reliability.
TSOP packaging technology was successfully developed by Philips Company from 1968 to 1969. Later, it gradually derived SOJ (J-pin small outline package), VSOP (very small outline package), SSOP (shrunken SOP), TSSOP (thin reduced outline package) Type SOP) and SOT (Small Outline Transistor), etc.