TSOP package has the following characteristics:
1. Small size, light weight, high efficiency and energy saving.
2. Easy to manufacture and low cost.
3. Easy to automate production and facilitate integrated multi-functional design.
4. Good electrical performance and reliability.
5. The pin spacing is small, usually 0.5 mm or less, suitable for high-density circuit design.
6. The packaging height is low, which is conducive to the compact design of electronic equipment.
TSOP packaging is also widely used in communications, computers, consumer electronics and other fields. It can provide reliable electrical connections and good thermal management while meeting high-speed data transmission and small size requirements.