In BGA, VIPPO refers to Vertical Interconnect Access. It is an interconnect technology used to connect chips to external circuits and is typically used in high-density, high-performance packages. It can be a through hole or a blind hole.
The main advantages of VIPPO include increased signal transmission speed, reduced power consumption, reduced parasitic effects and reduced noise interference. In addition, VIPPO can also provide higher chip packaging density and more reliable signal transmission performance.