In PCB, Cerdip package is a glass-sealed ceramic dual-in-line package used for circuits such as ECL RAM, DSP (Digital Signal Processor), etc. It has a glass window and can be used for UV erasable EPROM and microcomputer circuits with EPROM inside. The pin center distance is 2.54mm, and the number of pins ranges from 8 to 42. In Japan, this kind of packaging is represented as DIP-G (G means glass seal).