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What does cerdip encapsulation mean in pcb glass

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In PCB, Cerdip package is a glass-sealed ceramic dual-in-line package used for circuits such as ECL RAM, DSP (Digital Signal Processor), etc. It has a glass window and can be used for UV erasable EPROM and microcomputer circuits with EPROM inside. The pin center distance is 2.54mm, and the number of pins ranges from 8 to 42. In Japan, this kind of packaging is represented as DIP-G (G means glass seal).

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The main application scenarios of Cerdip packaging include ECL RAM, DSP (digital signal processor) and other circuits. In addition, it is also commonly used in ultraviolet erasable EPROM and microcomputer circuits with EPROM inside.

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