BGA packaging technology is an electronic packaging technology that has the advantages of high density, high performance, and high reliability. In PCB, BGA packaging technology is used to connect the chip and the substrate together to realize circuit transmission and signal transmission.
The advantages of BGA packaging include:
1. The number of input and output pins is greatly increased, and the pin spacing is much larger than that of QFP. In addition, it has an automatic alignment function with the circuit pattern, thus improving the assembly yield.
2. Although its power consumption increases, it can be welded by the controlled collapse chip method, and its electrothermal performance has been improved; for chips with high integration and high power consumption, use ceramic substrates and install them on the casing The micro exhaust fan dissipates heat to achieve stable and reliable operation of the circuit.
3. The thickness of the package body is reduced by more than 1/2 than that of ordinary QFP, and the weight is reduced by more than 3/4.
4. The parasitic parameters are reduced, the signal transmission delay is small, and the frequency of use is greatly increased.
5. Co-planar welding can be used for assembly, with high reliability.
Disadvantages of BGA packaging include:
1. BGA packaging is still the same as QFP and PGA, occupying too large a substrate area.
2. The warpage problem of plastic BGA packaging is its main defect, that is, the coplanarity problem of solder balls.
3. Due to the high cost of the substrate, its price is very high.