In the PCB process, gold plating is usually performed first and then immersed in gold.
First of all, gold plating refers to plating a layer of metal on the surface of a copper plate to improve the conductivity and corrosion resistance of the circuit board. Usually, a layer of nickel is first plated on the surface of the copper plate, and then a layer of gold is plated to form a corrosion-resistant, good conductive surface protective layer.
Secondly, immersion gold is an electroplating process. By plating a layer of metal on the surface of the circuit board, the conductivity and corrosion resistance of the circuit board can be improved. In the immersion gold process, two methods, electroless nickel immersion and chemical immersion gold, are usually used. Electroless nickel deposition refers to the deposition of a layer of nickel on the surface of a copper plate through a chemical reaction, while electroless gold deposition refers to the deposition of a layer of gold on the surface of nickel.
Therefore, in the PCB process, gold plating is usually performed first and then immersed in gold. Gold plating first can form a good conductive surface protective layer, while immersion gold can further improve the conductivity and corrosion resistance of the circuit board.