Etching solutions may contain the following other chemicals:
1. Ammonium fluoride (NH4F): As an etchant, it plays a corrosive role in the etching solution. Industrial products are generally used.
2. Oxalic acid (H2C2O4): used as a reducing agent in the etching solution, generally industrial products are used.
3. Sodium sulfate (Na2SO4): used as a filler in the etching solution, generally industrial products are used.
4. Hydrofluoric acid (HF): It is an aqueous solution of hydrogen fluoride. It is a colorless liquid that can smoke in the air. It is highly corrosive and toxic and can corrode glass. It needs to be stored in lead, wax or plastic containers. It can be used as the main raw material for etching glass, and industrial products are generally used.
5. Sulfuric acid (H2SO4): The pure product is a colorless oily liquid, which turns yellow, brown and other colors when containing impurities. When diluting with water, concentrated sulfuric acid should be slowly injected into the water and stirred at any time. Water should not be poured into the concentrated sulfuric acid to prevent accidents caused by splashing of concentrated sulfuric acid. It can be used as a corrosion aid, and industrial products are generally used.
6. Ammonium sulfate ((NH4)2SO4): Generally, industrial products are used.
7. Glycerin (C3H5(OH)3): Generally, industrial products are used.
8. Water (H2O): tap water.
In addition, the etching solution may also contain other ingredients, such as organic solvents, surfactants, etc., to improve the physical and chemical properties and processing performance of the etching solution. The exact ingredients depend on the type and purpose of the etching solution.