The requirements for via size during PCB board production are as follows:
1. According to the wire width and printed board thickness, the general process capability of the via hole inner diameter (mechanical drilling) is ≥0.3mm.
2. According to the width of the wire and the thickness of the printed board, the general process capability of the through-hole single-sided solder ring is ≥6mil (0.1524mm).
3. When producing PCB boards, the inner diameter of via holes is recommended to be 0.4~0.6mm, and the outer diameter is recommended to be 0.6~1mm.
4. Safety distance: The general process capability of the spacing between components is ≥0.16mm. It is recommended that PIR≥0.5mm and PowerBank ≥0.3mm. The general process capability of the spacing between the board edge and lines, devices and pads is ≥0.3mm.