The advantages of HDI PCB include:
1. Light, thin, short and small. These characteristics can increase circuit density, facilitate the use of advanced packaging technology, greatly improve signal output quality, greatly improve the functions and performance of electronic and electrical products, and also It can make electronic products more compact and convenient in appearance.
2. Using thinner base materials for prepregs in HDI PCB fabrication technology has the advantage of improving heat transfer across the board. Furthermore, manufacturers can choose materials that have high electrical resistance but low thermal resistance. As a result, a densely packed PCB dissipates heat more efficiently, and all components on the PCB operate within their safe zones.
3. The main advantage of HDI PCB production technology is that denser BGA and QFP packages can be used to fill the PCB. The development of high-speed serial bus technology is continuously pushing up the signal transmission rate.
4. At very high frequencies, dielectric losses become the dominant loss mechanism, with thermal energy lost as the substrate charges and discharges. However, HDI PCB manufacturers can use a variety of substrates that have extremely low ultra-low loss losses. Although designers cannot completely avoid dielectric loss, when using low-loss materials to build HDI PCBs, dielectric loss only becomes the dominant loss mechanism at much higher frequencies than would normally occur.
To sum up, the advantages of HDI PCB are mainly reflected in the aspects of being light, thin, short, and small. It can also increase circuit density, improve heat dissipation, and increase signal transmission rate.