In PCB circuits, flux and solder mask are two different parts, but there is a certain relationship between them.
Flux is often coated on the pads and pins on the PCB surface to aid the soldering process. It removes the oxide film and provides some adhesion so that the solder can better adhere to the metal surface. During the welding process, flux can reduce welding defects such as weld beads, cracks, etc., and improve welding quality.
Solder mask is a coating that usually covers the copper traces and pads on the surface of the PCB. Its main function is to prevent copper traces and pads from being exposed to air, thereby preventing them from oxidizing. Another function of the solder mask is to provide certain mechanical protection to prevent the PCB from being damaged during manufacturing, transportation and use.
In PCB circuits, flux and solder mask complement each other. Although their functions are different, they are all designed to improve the welding quality and protect the PCB surface. In practical applications, appropriate flux and solder resist should be selected according to specific needs to ensure the performance and reliability of the PCB circuit.