CSP (Chip Scale Package) is an advanced form of integrated circuit packaging. It has the advantages of small size, small area, thin thickness, large number of pins, good electrical performance, good thermal performance, light weight, and good air tightness. Features of the CSP package include:
1. Small size: The size of the CSP packaged chip is similar to the chip itself, which is much smaller than traditional packaging forms such as QFP (four-side pin flat package).
2. Small area: The area of the CSP packaged chip is similar to the chip itself, which is much smaller than traditional packaging forms such as QFP (four-side pin flat package).
3. Thin thickness: The thickness of CSP packaged chips is much thinner than traditional packaging forms such as QFP (four-side pin flat package).
4. Large number of pins: CSP packaged chips have much more pins than traditional packaging forms such as QFP (four-side pin flat package).
5. Good electrical performance: The length of the interconnection line between the chip and the package wiring inside CSP is shorter than that of QFP or BGA, so the parasitic parameters are small and the signal transmission delay time is short, which is beneficial to improving the high-frequency performance of the circuit.
6. Good thermal performance: CSP is very thin, and the heat generated by the chip can be transmitted to the outside world through a short channel. The chip can be directly and effectively dissipated through air convection or the installation of a radiator.
7. Light weight: The weight of CSP packaged chips is much lighter than traditional packaging forms such as QFP (four-side pin flat package).
8. Good air tightness: The whole process is produced in a chip-level purified space, without plastic packaging, and the chip electrodes are directly attached to the required circuit board.
The CSP packaging form has many advantages and is one of the most advanced integrated circuit packaging forms currently.